-40%

Silver Conductive Easy 1 to 1 Mix Ratio RMI EFI Shielding PCB Epoxy 250 gm, 907

$ 371.7

Availability: 800 in stock
  • Substrates 2: nickel, kovar, ceramic, glass
  • Benefits: High strength Perfect bond Cold solder
  • Condition: New
  • Country/Region of Manufacture: United States
  • All returns accepted: ReturnsNotAccepted
  • MPN: 907-250
  • Substrates 3: phenolic and G-10 epoxy glass boards.
  • Brand: Atom Adhesives
  • Typical Applications 1: Electrical, conductive, rmi / efi shielding
  • Typical Applications 2: circuitry printed circuit board electronic repair
  • Substrates 1: aluminum, copper, magnesium, steel, bronze
  • Model: AA-DUCT 907-250

    Description

    Technical Product Bulletin
    PURE SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY MAXIMUM CONTINUITY OF CONDUCTIVITY
    PRODUCT DESCRIPTION:
    AA-DUCT 907 is an epoxy adhesive and coating formulation based on pure silver.  This versatile silver formulation offers the maximum
    continuity of conductivity with an electrical resistivity value of less than 1x10
    -4
    ohm·cm.
    AA-DUCT 907 is also characterized by a wide
    operating temperature range from –50 to +170°C.
    AA-DUCT 907 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
    GENERL PROPERTIES:
    Appearance
    Silver
    Cure Type
    Heat cure or Room Temperature
    Benefits
    ·
    High strength
    ·
    Perfect bond
    ·
    Cold solder for heat sensitive components
    Mix Ratio by weight
    100:100 / Resin: Hardener
    Substrates
    Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
    Typical Applications
    Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
    UNCURED PROPERTIES:
    Viscosity @ 25 °C  cps
    Paste
    Specific Gravity, mixed
    2.79
    Reactive solids contents, %
    100
    Pot Life
    1 Hour
    Shelf life
    6 months
    CURE SCHEDULE:
    15 minutes
    @ 100°C
    45 minutes
    @ 50°C
    24  hours
    Room temperature
    CURED PROPERTIES:
    Hardness, Shore D
    85
    Shrinkage linear in/in
    0.0003
    Lap shear strength, psi
    9400
    Volume Resistivity ohm. cm
    0.0001
    Thermal Expansion Coefficient,
    (cm / cm / °C · 10-5)
    1.5
    Thermal Conductivity,
    btu / hr / ft2 / °F / in:
    100
    Tensile Strength, psi:
    9,500
    Compressive Strength, psi
    14,000
    Heat Distortion, °C
    170
    Operating Temperature °C
    -50 to +170
    GENERAL INFORMATION:
    For safe handling information on this product, consult the
    Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1.
    Carefully clean and dry all surfaces to be bonded.
    2
    .
    Apply AA-DUCT 907 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure
    is  adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3.
    Some separation of components is common during
    shipping and storage. For this reason, it is recommended that the contents of the
    shipping container be thoroughly mixed prior to use.
    4.
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle
    of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid
    components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in many different packages.
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