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MG Chemicals 8329TCM-200ML Medium Cure Thermal Conductive Adhesive 200ML Can
$ 58.6
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Description
MG Chemicals 8329TCM-200ML Medium Cure Thermal Conductive Adhesive 200ML CanCondition: New
Manufacturer: MG Chemicals
Part Number: 8329TCM-200ML
The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cure adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.
Excellent 1.36 W/(m*K) thermal conductivity
Easy 1-to1 mix ratio
Adheres to most electronic substrates
Stores and ships at slightly below room temperature - no freezing or dry ice required
Very long shelf life of at least two years - even when stored at room temperature
Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons