Kester Solder #245-No-Clean / 24-6337-8853: / Sn63 Pb37 / .015" / 3% /

Description

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• Kester 24-6337-8853
• Alloy: Sn63 Pb37 ( 63% tin - 37% lead )
• Diameter: .015"
• Core: 3.3% by volume  ( #66 )
• Flux: #245-No-clean-rosin
• DOM: 2015
• Qty: 1 Lb. spool
• THE INDUSTRY STANDARD FOR NO CLEAN ROSIN-CORE SOLDERS.
• Concorde is an Authorized Kester Solder distributor
"245" No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.
• Compatible metals: Platinum, gold, copper, tin, solder and silver.
245 Product Performance
• Most common tin-lead eutectic used in pcb assembly applications
• Non-corrosive, non-conductive post-soldering residue
• Residues are kept to a minimum
• Most applications do not require residue removal
Kester Specifications:
• Alloy: Sn63 / Pb37 (63% tin, 37% lead)
• Wire Diameter: .015"
• Core Flux: No Clean
• Core Size : 66 (3.3% by volume)
• Spool Size: 1 lb.
• Melting Range: 361º F, 183º C
• Classified as ROL0 per ANSI-J-STD-006C
• Meets Federal spec: QQ-S-571e and Military spec. MIL-F-14256, ROLO
• Compliant to Bellcore GR-78
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