-40%
Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025
Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025
Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025
Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025
Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025

Kester Solder 24-6337-8809: #245-No-Clean Flux / Sn63Pb37 / .025" / 1% 1-lb

$ 19.13

Availability: 53 in stock
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back
  • Solder Form: Wire
  • Model: SN63PB37 .025 NO-CLEAN CORE SOLDER
  • Solder Type: 63/37 No-Clean
  • Condition: New
  • Country/Region of Manufacture: United States
  • Item must be returned within: 30 Days
  • All returns accepted: Returns Accepted
  • MPN: 24-6337-8809
  • Brand: kester

    Description

    FREE SHIPPING
    • P/N: 24-6337-8809
    • Kester Sn63/Pb37 ALLOY solder,
    • Diameter: .025"
    • Flux: #245-No-Clean
    • Core: 50 (1.1%)
    • Qty: 1 Lb. spool
    • Concorde-Electronics is an authorized Kester Solder distributor
    "245" No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.
    • Compatible metals: Platinum, gold, copper, tin, solder and silver.
    "245" Product Performance
    • Most common tin-lead eutectic used in pcb assembly applications
    • Non-corrosive, non-conductive post-soldering residue
    • Residues are kept to a minimum
    • Most applications do not require residue removal
    Kester Specifications:
    • Wire Diameter : .025"
    • Alloy: Sn63 / Pb37 (63% tin  -  37% lead)
    • Core Flux: No Clean
    • Core Size : 1.1%
    • Spool Size: 1 lb.
    • Melting Range: 361º F, 183º C
    • Classified as ROL0 per ANSI-J-STD-006C
    • Compliant to Bellcore GR-78