Kester Lead Free Solder 24-9574-7618: K100 Silver Free / #275-No-Clean / .031

Description

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• Low cost alternative to SAC-305
• Kester K100LD Lead-Free Silver-Free alloy solder
• Diameter:
.031"
• Core:  66 (3.3%)
• Flux: #275 No-clean rosin
• Qty: 1 Lb spool
• MEETS ANSI-J-006 QUALITY SPECIFICATIONS AS WELL AS FEDERAL SPEC: QQ-S-571e AND MILITARY SPEC: MIL-F-14256, TYPE RMA
• THE INDUSTRY STANDARD FOR LEAD-FREE, NO-CLEAN-CORE SOLDERS.
• DOM: 01/15
• Concorde-Electronics is an Authorized Kester Solder distributor
K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.
K100LD SN99.3 CU.07 Features
• Prevent copper erosion and yield consistent soldering results
• Designed to give excellent wetting to through-hole and bottom side SMT components
• Dross-reducing technology results in 20% lower dross formation
• Lower cost than SAC305
• Produces shiny, smooth solder joints
Kester "275 NO-CLEAN flux is more effective than  standard rosin flux
when working with difficult-to-solder metals and does not need to be cleaned after soldering.
'275' flux is non-corrosive and non-hydroscopic
Specifications:
• Tin: 99.3%, Silver : 0%, Copper: 0.7%
• Contains Nickel and Bismuth
• Melt Point: ~227̊ C
• Appearance: Shiny
• Shrink Holes: No
• Copper Dissolution: (Sn63=1): 0.8
• Size: 1 lb. Spool
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