-40%

Kester Lead Free Solder 24-9574-6403: K100 / #331-Water-Soluble / .031 / 1-Lb

$ 31.15

Availability: 97 in stock
  • Model: KESTER K100 .031 DIA., 66/331 CORE SOLDER
  • Return shipping will be paid by: Buyer
  • Modified Item: No
  • type:: K100LD
  • Flux:: #331 Water soluble organic
  • Alloy:: Sn99.3 Cu.7 (Tin-Copper)
  • Core size:: 3.3% (#66)
  • Condition: New
  • Compare to:: SAC305 Solder
  • Brand: Kester Solder
  • alloy description:: 99.3 tin // .7 copper
  • wire diameter:: .031"
  • Country/Region of Manufacture: United States
  • MPN: 24-9574-6403
  • Solder Type: Silver-Free Lead-Free Water Soluble
  • All returns accepted: Returns Accepted
  • Wire Diameter: 0.031 in
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Solder Form: Wire

    Description

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    • A low cost alternative to SAC-305
    • Kester P/N: 24-9574-6403
    • Kester Solder K100LD Lead-Free, Silver-Free alloy solder.
    • Diameter: .031"
    • Core:  3.3% by volume ( #66 )
    • Flux: #331 (Water-soluble, organic)
    • Qty: 1 Lb. spool
    • RoHS compliant
    • DOM: 2020
    • Concorde-Electronics is an Authorized Kester Solder distributor
    K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.
    K100LD Features:
    • Prevent copper erosion and yield consistent soldering results
    • Designed to give excellent wetting to through-hole and bottom side SMT components
    • Dross-reducing technology results in 20% lower dross formation
    • Lower cost than SAC305
    • Produces shiny, smooth solder joints
    Kester "331" Organic water-soluble flux is more effectivee than rosin flux when working with difficult-to-solder metals. Organic flux is more heat stable than most organic fluxes and the residue can be completely removed with a simple water rinse
    Specifications:
    • Tin: 99.3%  Copper: 0.7%
    • Contains Nickel and Bismuth
    • Melt Point: ~227̊ C
    • Appearance: Shiny
    • Shrink Holes: No
    • Copper Dissolution: (Sn63=1): 0.8
    • Size: 1 lb. Spool
    • Meets ANSI-J-STD-006C, Federal spec: QQ-S-571e and Military Spec: MIL-F-14256,
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