-40%
183°C Low Melt Solder Flux Paste Tin Cream Welding XG-50 For Micro Soldering
$ 4.94
- Description
- Size Guide
Description
Product Description183°C Low Melt Solder Flux Paste Tin Cream Welding XG-50 For Micro Soldering
Product description:
Melting point is 138°C. You will not need it often, so you need to prepare a small bottle. These things allow you to remove components and connectors without using the ultra-high heat required to melt high-temperature lead-free solder. Just put a little bit of these things on the logic board, then use a soldering iron to mix the lead-free solder with the low melting point solder paste, and then use micro tweezers or a hot air rework station to remove the connector/component at around 225°C.
Model: XG-50
Scope of application: mobile phone chip repair, computer or home appliance chip patch repair, BGA special products, chip-level repair tools
Applicable models: tin planting for cell phone repairs, BGA planting tin for computers in the electronics industry.
Features: The solder joints are white and full, no false soldering, false soldering, etc., and it has a very strong reconciling force with the soldering iron nozzle. It is a must for repairing mobile phones and precision equipment. It is also an electronic production line, ideal for soldering Supplies.
Package list:
1*solder paste
Note:
1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
2. Please allow slight manual measurement deviation for the data.
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Delivery details
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It takes about
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-15 working days to US; about 10-30 working days to other countries.
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